Technology

 

THE MAIN CLEANROOMS cover a total area of 2 600 m² and range from Class 10 (ISO 4) to 1000 (ISO 6). Cleanrooms are of the Clean Bay–Service Chase type, with a raised, perforated floor and ventilation based on filter-fan units. There are two additional modular cleanrooms for back-end and ion implantation processes (Class ISO 6).

 In addition to standard CMOS equipment we have special tools and processes like:

   Anhydrous HF vapor etching

   Critical-point drying

   Deep reactive ion etching of silicon or glass

   Atomic layer deposition

   Ion trimming

   Controlled film stress in LPCVD

   Chemical-mechanical planarization

   Wafer thinning by grinding

   Polymer coating

   Thin-wafer handling