THE MAIN CLEANROOMS cover a total area of 2 600 m² and range from Class 10 (ISO 4) to 1000 (ISO 6). Cleanrooms are of the Clean Bay–Service Chase type, with a raised, perforated floor and ventilation based on filter-fan units. There are two additional modular cleanrooms for back-end and ion implantation processes (Class ISO 6).
In addition to standard CMOS equipment we have special tools and processes like:
Anhydrous HF vapor etching
Deep reactive ion etching of silicon or glass
Atomic layer deposition
Controlled film stress in LPCVD
Wafer thinning by grinding